Viaduct
Assembly Line
Viaduct Raises $10 Million in Series B Funding Round
Viaduct, a developer of pioneering AI technology that identifies, solves and predicts product failures, announces the close of a $10 million Series B funding. The round was led by FM Capital, a venture capital firm which invests in the people and technologies that are transforming the automotive and transportation industries. FM Capital was joined by Innovation Endeavors, Exor Ventures, Stellantis Ventures and Sumitomo Rubber.
The company will use the proceeds to accelerate both business development and deployments for its solution that helps customers improve product quality, boost customer satisfaction and drive operational efficiency. Viaduct’s patented TSI Engine is the only AI-powered solution that intelligently and automatically analyzes thousands of variables hidden in terabytes of data to discover patterns of health, defects and performance in products across a wide range of industries.