Ushio
Assembly Line
Breakthrough Digital Lithography Technology From Applied Materials and Ushio to Enable More Powerful Computing Systems for the AI Era
Applied Materials, Inc. and Ushio, Inc. announced a strategic partnership to accelerate the industry’s roadmap for heterogeneous integration (HI) of chiplets into 3D packages. The companies are jointly bringing to market the first digital lithography system specifically designed for patterning the advanced substrates needed in the Artificial Intelligence (AI) era of computing.
The new DLT system is the only lithography technology that can achieve the resolution necessary for advanced substrate applications while delivering throughput levels required for high-volume production. With the ability to pattern less than 2-micron line widths, the system enables the highest area density for chiplet architectures on any substrate, including wafers or large panels made of glass or organic materials. The DLT system is uniquely designed to solve unpredictable substrate warpage issues and achieve overlay accuracy. Production systems have already been shipped to multiple customers, and 2-micron patterning has been demonstrated on glass and other advanced package substrates.