Tignis
Canvas Category Software : Engineering : Digital Twin
Tignis provides a physics-driven software solution for managing industrial assets, processes and operations. Using machine learning and digital twins, Tignis monitors mechanical systems, not just individual assets, so manufacturers can expand predictive maintenance coverage, detect and reduce risks to plant or line reliability, enhance O&M team productivity, and improve plant performance.
Assembly Line
Aftermarket Sensors Boost Yield In Wafer Fabs
Third-party sensors are being added into fab equipment to help boost yield and to extend the life of expensive tools, supplementing the sensors that come with equipment used in fabs.
Sensors for temperature, pressure, humidity, gas concentrations, vibration and current can be found throughout the process tools and associated sub-systems. Third-party sensors are often added after installation and initial process development. Those sensors also can be applied to sub-fab intake and outtake pipes to monitor parameters that illuminate issues affecting process variability and defectivity. In addition, equipment teams can use instrumented wafers as a source for equipment set-up, post maintenance qualification and for predictive maintenance algorithms.
The good news is that integrating 3rd-party sensor data into factory data management systems is straightforward, especially when sensors use established SEMI standards like SECS/GEM. Even if they don’t adhere to those standards, the barrier to connect them to a factory’s data infrastructure is low. But to maximize their usefulness, several industry experts emphasized the importance of traceability and the ability to correlate data from different sources in context.
Tignis, a Technology Innovator in AI Process Control Solutions for Semiconductor Manufacturing, Announces $7.2 Million in Series A Funding to Expand Sales Team, Take Company to the Next Level of Growths
Tignis, a technology innovator in AI process control for semiconductor manufacturing, today announced the completion of $7.2 million in Series A Funding led by early-stage venture capital fund DN Capital with participation by Silicon Valley venture capital firm Clear Ventures, former Microsoft Executive/VMware CEO Paul Maritz and former GE Digital CTO Harel Kodesh.
“This funding will accelerate Tignis on its journey of advancing physics-driven AI process control as an enabler of the next generation of semiconductor manufacturing,” said Jon Herlocker, president and CEO of Tignis. “AI Process control will accelerate semiconductor process development, improve efficiency and quality, and enable manufacturing technologies that previously were too complex to model, resulting in production of smaller and more complex chips, faster time to market and improved yield while reducing the cost of operations. In addition, the advancement of AI process control technology in semiconductor manufacturing that Tignis is undertaking is of particular importance to the US market, to re-establish competitiveness and leadership in this industry.”