OCCIDENT
Assembly Line
Chipmetrics Secures € 2.4 Million Seed Funding Round to Accelerate Product Innovation and Global Expansion
Chipmetrics Ltd, the Atomic Layer Deposition (ALD) technology company and a pioneer in 3D ultra-high aspect ratio test elements for metrology of semiconductor and advanced thin film material manufacturing, proudly announces the successful closure of a €2.4 million investment round. The international investor syndicate was led by High-Tech Gründerfonds (HTGF) and co-led by OCCIDENT from Germany. Other investors were Innovestor, REDSTONE and BALD Engineering. This substantial investment serves as a testament to Chipmetrics’ groundbreaking advancements in the PillarHall® metrology test chip technology, positioning the company as a frontrunner in conformality measurements in material deposition processes. The funds raised will be instrumental in accelerating Chipmetric’s product development efforts, scaling production capabilities, and expanding its market presence with the already existing international customer base.