Halo Industries
Assembly Line
Halo Industries Closes $80 Million Series B Funding Round Led by Thomas Tull’s U.S. Innovative Technology Fund
Halo Industries, Inc., the creator of a laser manufacturing technology platform for the semiconductor industry, announced it raised up to $80 million in its oversubscribed Series B funding round. Led by Thomas Tull’s U.S. Innovative Technology Fund (USIT) with participation from 8VC and SAIC, the funding will help Halo Industries scale the commercialization and reach of its technology and advance its mission to establish the new gold-standard of silicon carbide substrate production.
Halo Industries’ proprietary laser-based tools and processing technologies enable efficient, precise and high-quality manufacturing that minimizes the cost, waste and environmental impact associated with traditional manufacturing methods. The company manufactures several materials used for semiconductor production, including silicon carbide (SiC) wafers, which serve as the building block of efficient high voltage power electronics. Leveraging SiC wafers for power devices enables greater power output and system performance while being smaller, lighter, and more robust than traditional materials. SiC is a hard, brittle material that is challenging to cut without losing meaningful amounts, and Halo Industries’ proprietary laser-based slicing tools significantly increase yield and quality of SiC while minimizing waste and production cost.