Broadcom
Canvas Category OEM : Semiconductor
Broadcom Inc. is a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. Broadcom’s category-leading product portfolio serves critical markets including data center, networking, software, broadband, wireless, storage and industrial. Our solutions include data center networking and storage, enterprise and mainframe software focused on automation, monitoring and security, smartphone components, telecoms and factory automation.
Assembly Line
TSMC Advances in Silicon Photonics: Broadcom and NVIDIA Set to Be First Customers
According to a report by the Economic Daily News, TSMC has made significant progress in its silicon photonics strategy. The company recently achieved the integration of co-packaged optics (CPO) with advanced semiconductor packaging technologies, with sample deliveries expected to commence in early 2025. This milestone positions TSMC to usher in the 1.6T optical transmission era by the second half of 2025. Industry sources anticipate Broadcom and NVIDIA as TSMC’s first customers for these solutions.
The silicon photonics era could materialize as early as 2025. Reports indicate that TSMC, in collaboration with Broadcom, has successfully trial-produced a key CPO technology, the micro ring modulator (MRM), using its 3nm process. This development paves the way for integrating CPO with high-performance computing (HPC) or ASIC chips for AI applications, enabling a significant leap from electrical to optical signal transmission for computing tasks. The report also highlights challenges in the production of CPO modules. The complex packaging process and low yield rates suggest that TSMC might outsource some optical engine (OE) packaging orders to other advanced packaging providers in the future.
The Economic Daily News further cites industry sources suggesting that NVIDIA plans to adopt CPO technology starting with its GB300 chips, set for release in the second half of 2025, and its subsequent Rubin architecture. This move aims to address the limitations of the current NVLink 72 interconnect, which connects up to 72 GB200 chips, by enhancing communication quality and mitigating signal interference and overheating issues in HPC applications.
VMware by Broadcom Builds Software-Defined Edge for Manufacturing Facilities
VMware offers a platform solution – the VMware Edge Compute Stack – that is edge-optimized and designed to help manage edge at scale with limited resources.
The goal, VMware says, is to reduce the number of dedicated function devices and enforce a single operating model to manage workloads at factories. The VMware Edge Compute Stack is based on VMware ESXi which provides it real-time capabilities to keep applications up-to-date automatically. The Edge Compute Stack adopts a proven management model called pull mode approach. This ensures that connected devices scan for updates and maintain a desired state autonomously.
Broadcom’s transformation journey with Google Cloud
Since the migration to Google Cloud, we’ve eliminated 165 software test labs and saved 50% on costs by hosting most of our work on the cloud instead of relying on dedicated hardware running in Broadcom data centers.
Our collaboration with Google Cloud has also enabled Broadcom to deliver new product features faster while keeping products up to date and free of technical debt. This is a major competitive boon. Adopting Google Cloud as a scalable platform for product development, we now deliver rapid elasticity when catering to increased spikes in requests for products that can reach up to a million requests per second. Equally important, it’s helped us keep the platform secure to protect our customers’ workload and data.
Prior to migrating, Broadcom operated 50-plus data centers globally. The plan was to replace all 50-plus data centers in six months—which we did. It was crucial that we got this right because the workloads were time-sensitive and customer-sensitive, and any glitch could have a huge impact on customers.
Apple announces multibillion-dollar deal with Broadcom for components made in the USA
Today Apple announced a new multiyear, multibillion-dollar agreement with Broadcom, a leading U.S. technology and advanced manufacturing company. Through this collaboration, Broadcom will develop 5G radio frequency components — including FBAR filters — and cutting-edge wireless connectivity components. The FBAR filters will be designed and built in several key American manufacturing and technology hubs, including Fort Collins, Colorado, where Broadcom has a major facility.
Celestial AI Raises $56 Million Series A to Disrupt the Artificial Intelligence Chipset Industry with Novel Photonic-Electronic Technology Platform
Celestial AI, an AI-accelerator company with a proprietary hardware and software platform for machine learning chipsets, today announced a $56 million Series A investment led by Koch Disruptive Technologies (KDT) with participation from Temasek’s Xora Innovation fund, The Engine, the venture firm spun out of MIT, Tyche Partners, Merck’s corporate venture fund, M-Ventures, IMEC XPand, and venture capital investor in the Princeton University ecosystem, Fitz Gate. The new capital will be used for expanding the global engineering team, product development and strategic supplier engagements, including Broadcom, to build the company’s Orion AI accelerator products. Celestial AI’s mission is to fundamentally transform the way computing is done with a new processing system, based on their proprietary Photonic Fabric™ technology platform, that uses light for data movement both within chip and between chips.