Accelsius
Assembly Line
Accelsius Secures $24M in Series A Funding to Efficiently Cool AI Data Centers
Accelsius™, whose proprietary two-phase, direct-to-chip liquid cooling systems enable high-performance computing and rack density for data center and edge operators, announced the successful raise of $24 million pursuant to a Series A funding round. The Series A funding round started in early 2024. Funding for this round has been provided from and privately raised by Innventure, Inc. (NASDAQ:INV), who founded Accelsius in June 2022. Innventure is a technology commercialization platform that founds, funds and supports the launch and scale of its companies with a focus on transformative technology solutions.
Accelsius will use the funds to accelerate its plans for an international presence, continue to grow shipments and revenue in the U.S., and expand its professional teams across engineering, R&D, sales, marketing, manufacturing and operations. The company, recently selected as one of Austin Business Journal’s 2024 Best Places to Work, already employs some of the industry’s brightest and best thermal scientists and enterprise-grade system engineers.