Voidless
Assembly Line
Milan-based Voidless raises €2.2 million to confront the overpackaging problem with “box on demand” solution
Voidless, an Italian deeptech startup that has focused its activity on solving the overpackaging problem, announced the closing of a seed round of €2.2 million led by CDP Venture Capital – through the Corporate Partners I Fund – Industry Tech sector – and the Italian-French Venture Capital company 360 Capital. The two investors participated in the transaction by investing €1.1 million each.
This round – which follows the €600,000 pre-seed in July 2022 by 360 Capital – represents an important step for Voidless’ growth and will allow the startup to grow in the market with its next-generation “box on demand” machinery, designed to create boxes and packaging tailored to each type of shipment with extreme precision directly in warehouses. offering an effective and concrete solution to the problem of overpackaging. In addition, the capital injection will also support the consolidation of the Voidless team.