Thintronics
Canvas Category OEM : Computer and Electronic
Thintronics Inc. is reinventing interconnect insulator technologies to unlock next- generation computing, networking and wireless performance. The company’s novel materials enable wider bandwidths, increased power efficiency, and highly integrated form factors for advanced computing and communication systems.
Assembly Line
Thintronics Inc. Closes Its Series A Extension
Thintronics Inc. closed its Series A Extension having added M Ventures, the CVC arm of Merck KGaA, TGVP, the US CVC arm of TOPPAN Holdings, and previous investor Tallwood Venture Capital to the Thintronics Series A syndicate. The series was led by Maverick Capital and Translink Capital.
Thintronics Inc. is a California-based electronic materials startup supplying high-performance insulators for emerging AI datacenter, networking, and RF/millimeter-wave (mmW) applications.
The addition of M Ventures, TGVP and Tallwood delivers significant strategic advantages for Thintronics. M Ventures brings an important partnership with Merck KGaA, one of the leading semiconductor materials providers in the market and a global player in science, technology and manufacturing worldwide. TGVP brings Thintronics into TOPPAN’s ecosystem. TOPPAN is a leading global supplier of semiconductor packaging materials and a significant user of insulator materials for the sector. Along with Tallwood, a California based long-term semiconductor investor and an early Thintronics funder, the addition of these partners provides the company with important strategic intelligence into its target markets and significant technical and innovation resources that can accelerate and compliment their commercialization efforts.
Thintronics Inc. Closes $23M Series A Financing Round Led by Maverick Capital and Translink Capital
Thintronics Inc. is a California-based electronic materials startup supplying high-performance insulators for emerging AI datacenter, networking, and RF/millimeter-wave (mmW) applications. Thintronics Inc. has raised a Series A funding round for $23M, led by Maverick Capital and Translink Capital. Series A funding will support commercialization of a novel insulator platform.