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TANAKA Establishes Bonding Technology for High-Density Semiconductor Mounting Using AuRoFUSEā¢ Preforms
TANAKA Kikinzoku Kogyo K.K., which develops industrial precious metals products as one of the core companies of TANAKA Precious Metals, announced that it has established a gold particle bonding technology for high-density mounting of semiconductors using AuRoFUSEā¢ low-temperature fired paste for gold-to-gold bonding.
AuRoFUSEā¢ is a composition of submicron-sized gold particles and a solvent that creates a bonding material with low electrical resistance and high thermal conductivity to achieve metal bonding at low temperatures. Using AuRoFUSEā¢ preforms (dried paste forms), this technology can reach 4 Ī¼m fine-pitch mounting with 20 Ī¼m bumps. Formed through a thermocompression bonding process (20 MPa at 200Ā°C for 10 seconds), AuRoFUSEā¢ preforms exhibit compression of approximately 10% in the compressive direction while showing minimal deformation in the horizontal direction. This gives them sufficient bonding strength1 for practical applications, making them suitable for use as gold bumps2. With the main component being gold, which has a high level of chemical stability, AuRoFUSEā¢ preforms also provide excellent reliability after mounting.
This technology enables miniaturization of semiconductor wiring and greater integration (higher density) for various types of chips. It is expected to contribute to the high-level technical innovation required of advanced technologies, including optical devices such as light-emitting diodes (LEDs) and semiconductor lasers (LDs), and use in digital devices such as personal computers, smartphones, and in-vehicle components.