Electroninks
Assembly Line
Electroninks Launches World-First Copper MOD Ink to Revolutionize Advanced Semiconductor Packaging
Electroninks, the leader in metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, announced the launch of the company’s advanced conductive copper ink line. The new copper ink extends Electroninks’ global-leading portfolio of metal complex inks while providing further manufacturing flexibility and lower total ownership costs to customers.
A high-demand application for the new copper ink is seed layer printing for fine-line metallization and RDL formation in combination with the company’s proprietary iSAP™ process. For this application, Electroninks copper ink effectively displaces industry use of electroless (e-less) copper plating and physical vapor deposition (PVD) tie layers while achieving a significant increase in manufacturing throughput and a vast reduction in ESG footprint. Compared to legacy methods (PVD and e-less), ink-based additive printing uses a fraction of the water and energy, factory footprint and CAPEX, thus providing customers with the lowest total cost of ownership and highest ROI on the market.