Alphawave Semi
Assembly Line
Alphawave Semi Launches Industry’s First 3nm UCIe IP with TSMC CoWoS Packaging
Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity and compute silicon for the world’s technology infrastructure, has launched the industry’s first 3nm successful silicon bring-up of Universal Chiplet Interconnect Express (UCIe™) Die-to-Die (D2D) IP with TSMC’s Chip-on-Wafer-on-Substrate (CoWoS®) advanced packaging technology.
The complete PHY and Controller subsystem was developed in collaboration with TSMC and targets applications such as hyperscaler, high-performance computing (HPC) and artificial intelligence (AI).
Using the foundry’s CoWoS 2.5D silicon-interposer-based packaging, the fully integrated and highly configurable subsystem provides 8 Tbps/mm bandwidth density and reduces I/O complexity, power consumption and latency.